الفهرس 
Boundary integral equation methodOnly 14 pages are availabe for public view
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Abstract
This research presents a rigorous analysis of the effect of
finite metallization thickness and finite conductivity on the
propagation characteristics of shielded microstrip and shielded
CP\V. It also presents an accurate full wave mode-matching
approach to analyze tile dispersion characteristics of millimeterwave
and microwave transmission lines with finite conductivity
and finite metallization thickness. The method is used to
determine the propagation constant, losses and field distribution
or the fundamental mode in shielded microstrip and shielded
CPW with finite metallization thickness and finite metallization
conductivity. The method is general and can be applied to
miniature MIC’s and Jv11v1IC’s including lossy semiconductor
substrate. The accuracy of the solution depends primarily on the
correct and complete description of eigenfunction expansions in
each of the uniform and nonuniform layer regions. The method
includes metallic loss by a self-consistent description without
any skin effect approximation. The analysis holds for arbitrarily
high losses and also metallization dimensions smaller than the
skin depth. The propagation constant for shielded microstrip
and shielded CPW is calculated for different structure
dimensions and for different substrate materials. The field
distribution is also traced for different substrate materials