الفهرس 
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Abstract
Solder is widely used as interconnection materials such as between the silicon die (or chip) and packaging substrate, and between electronic components and printed circuits board (PCB). As a joining material, solder provides electrical connection, thermal dissipation and mechanical support in electronic assemblies. The performance and quality of the solder joint are crucial to the overall functions of all electronic devices and circuits. Eutectic Sn-37wt%Pb (Sn-Pb) solder has been used extensively in the assembly of modern electronic circuits.
Due to the inherent toxicity of lead (Pb), environmental regulations around the world have been targeted to eliminate the usage of Pb-bearing solders in electronic assemblies. This has triggered the development of “Pb-free” solders used in electronic industries. In order to become a successful solder material, Pb-free solder alloys need to be reliable over long term use. Even though many Pb-free solder alloys possess higher strength than the traditional Sn-Pb ones, there still exist reliability problems such as solderability and interfacial reaction on metallization pad of packaging substrate. It is the aim of this study to develop new Pb-free solders with better properties.